Die Bonder Demos: Test With Your Own Dies
A buyer's guide to requiring a die bonder demonstration with the buyer's actual semiconductor dies, covering turret handling, closed-loop bonding pressure, and frame heating checks.
Make the demonstration run on your own semiconductor dies, not on the supplier's sample parts. Die geometry, surface condition, and incoming variation drive pick and placement behavior, so a demo with unfamiliar material tells you little about your assembly line.
Ask the supplier to run a defined batch of your dies through the multi-station turret so you can observe simultaneous pick, placement, and vision compensation under realistic timing. In the request for quotation, specify how many parts constitute a valid demonstration run and which acceptance measurements you will record. For closed-loop bonding pressure control, request a step-by-step record of commanded versus measured force across the range you intend to use. If frame heating is part of your process, ask whether the demonstration unit includes that option and confirm the heated-frame conditions used.
During the demo, ask: does vision compensation correct placement on your die features, or only on reference marks? How is a mispick detected and recovered? What happens to throughput when compensation cycles lengthen?
Before requesting a quote, confirm with the supplier which demonstration unit and configuration will be used, whether your dies can be returned or must be consumed, and how the acceptance results will be documented. Treat catalog values such as the turret architecture and closed-loop pressure control as reference descriptions, and verify the supplied model's configuration in writing.