Pass/Fail Checks for a Die Bonder Factory Acceptance Test
A buyer's guide to defining measurable pass or fail checks for a semiconductor die bonder factory acceptance test, covering turret handling, closed-loop bonding pressure, and frame heating.
Before signing off a semiconductor die bonder, decide which acceptance checks must pass on the floor and which can be verified later. For a multi-station turret with simultaneous pick, placement and vision compensation, ask the supplier to demonstrate that vision compensation corrects placement while pick and placement run concurrently, and define a pass criterion you can observe during the test.
For closed-loop bonding pressure control, request a demonstration showing how the loop responds when pressure deviates, and agree in advance what counts as a pass. If frame heating is included as an option, confirm whether the acceptance test covers it and how its readiness is checked.
Useful questions for the request for quotation or demonstration: Which checks are witnessed at the factory? What test material and die sizes are used? How is a failed check recorded and retested? These answers shape the acceptance test scope.
Before requesting a quote, confirm with the supplier which pass or fail checks are included in the factory acceptance test, how each is measured, and whether frame heating is covered.